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Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
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Preface. Simulation overview in the industry; B. Schwarz. Thermal & mechanical problems in microelectronics; O.F. Slattery, G. Kelly, J. Greer. Solder material characterization and modelling; S. Wiese, F. Feustel, E. Meusel. Polymer material characterisation and modelling; L.J. Ernst. Generic issues in numerical modeling; S. Pulko. Modeling of vapor pressure during reflow for electronic packages; X.J. Fan. Simulation for fatigue, cracks and delamination; R. Dudek, J. Auersperg, B. Michel. Experimental validation of finite element modeling; D. Vogel, C. Jian, I. De Wolf. Perspectives of non-linear simulation; M.A. Crisfield, A.J. Burton. Simulation-based optimisation in virtual thermo-mechanical prototyping of electronic packages; G.Q. Zhang, H.P. Stehouwer. Thermal fatigue reliability optimisation of Flip-Chip assemblies; B. Vandevelde, E. Beyne. Product and Process Optimization with simulation; D. den Hertog, P. Stehouwer.

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