Table of Contents

Volume 1:
1: Introduction to Robust Electronic Design. 2: Preparation for Robust Electronic Design. 3: Developing Products and Equipment Using Robust Electronic Design. Creating the Design Specification. Hammering Out Technical Issues (Engineering Verification). Developing a Usable Product or Piece of Equipment and Getting All Necessary Approvals (Design Verification). Tooling Up for Production (Manufacturing Verification). Starting Production, Announcing the Product, and Celebrating. 4: Noise Sources, Noise Coupling Paths, and Noise Victims. Noise Sources. Noise Victims. Noise-Coupling Paths. 5: Selecting Passive Components. 6: Resistors. 7: Fuses. 8: Capacitors. 9: Inductors and Transformers. 10: EMC Ferrites. 11: Crystals and Ceramic Resonators. 12: Switches, Controls, Indicators, Displays, and Relays. 13: Batteries, Fuel Cells, and Solar Cells. Batteries. Fuel Cells. Solar Cells. 14: Connectors. 15: Selecting Active Components. 16: Diodes. 17: Transient Suppressors and Surge Suppressors. 18: Transistors, FET's, and Thyristors. 19: Optoelectronics. 20: Integrated Circuits. Digital IC's. Analog IC's. Power IC's. IC Packages. 21: Designing Digital Circuits. 22: Designing Analog Circuits. 23: Designing Interface Circuits. 24: Designing Power Supply Circuits. 25: Designing Microprocessor and Microcontroller Circuits. 26: Partitioning. 27: Grounds and Returns. 28: Bypassing, Decoupling, and Power Distribution. 29: Wires, Traces, and Planes. 30: Transmission Lines. 31: Designing Printed Circuit Boards. Product Safety. Preparation for PCB Layout. Printed Circuit Board Schematics. Peer Reviews. Choosing the Board Materials. Choosing the Board Thickness. Choosing the Board Outline. Choosing the Board Stackup. Partitioning. Placing Components. Routing Traces. Partitioning Power and Return Planes. Final Checks before Release. Ampacity "Cheat Sheet". 32: Designing Cables and Backplanes. 33: Bonding. 34: Shielding. 35: Filtering. 36: Enclosures and Mechanical Design. 37: Software. 38: Watchdog Timers. 39: Thermal Considerations. 40: Finding and Fixing Problems. 41: Desk Checks. 42: Lab Tests. 43: ESD Testing. 44: Approval Testing. 45: EMC/EMI/ESD and Safety. 46: Some Parting Thoughts. Acronyms and Common/Trade Names. Bibliography. Conversion Factors. Glossary. Schematic symbols. Definitions of Symbols and Units. Index, Volumes 1 and 2.
Volume 2:
Appendix A: A Refresher on Circuit Analysis. Appendix B: Taylor Worst-Case Design. Appendix C: Important Properties of Conductors and Ferrites. Appendix D: Important Properties of Insulators and Semiconductors. Appendix E: Galvanic and Triboelectric Series. Appendix F: Important Properties of Wires and Cables. Appendix G: Important Properties of Printed Circuit Boards, Hybrid Modules, Flat Cables, and Busbars. Appendix H: Wire Gages. Appendix I: Sheet Metal Gages. Appendix J: Bergeron Diagrams. Appendix K: Electromagnetic Field Theory. Appendix L: International Power, Plugs, and Languages. Appendix M: International Safety Requirements. Appendix N: International EMC/EMI/ESD Requirements. Appendix O: Miscellaneous International Requirements. Appendix P: Finding and Buying Standards. Appendix Q: Glossary. Appendix R: Acronyms and Common/Trade Names. Appendix S: Definitions of Units and Symbols. Appendix T: Conversion Factors. Appendix U: Schematic symbols. Index, Volume 2.