Table of Contents

1. Field Ionization Sources.- 1.1. Gas Field Ionization Sources.- 1.2. Liquid Metal Field Ionization Sources.- 2. Physics of Liquid Metal Ion Sources.- 2.1. Introduction.- 2.2. Theory of LMIS Operation.- 2.3. Early Experiments on Emission of Ions from Liquid Metals (Pre-1975).- 2.4. Ion Production.- 2.5. Theoretical Description of LMIS Behavior.- 2.6. Experimental Studies of LMIS Shape.- 2.7. Later Theoretical Developments: Characterization of Emission.- 2.8. Liquid Flow Characteristics in the LMIS.- 2.9. The Effect of Space Charge on Ion Emission and the Shape of the I–V Characteristic.- 2.10. Low Current Emission.- 2.11. Conclusions Regarding LMIS Theory.- 2.12. LMIS Emission Characteristics.- 2.13. Elements and Alloys Used in LMIS.- 2.14. Energy Distributions.- 2.15. Angular Intensity and Distributions.- 2.16. Noise.- 2.17. Source Lifetime.- 2.18. Emitter Fabrication and Testing Methods.- 2.19. Properties of Materials Used In LMIS.- 3. Ion Optics for LMIS.- 3.1. Introduction.- 3.2. Optical Properties of the LMIS.- 3.3. Review of Charged Particle Optics.- 3.4. Lens Aberrations.- 3.5. Ion Focusing Systems for Field Emission Ion Sources.- 3.6. Wave Optics.- 3.7. Ion Optical Formalism and Resolution.- 3.8. Space Charge Effects.- 3.9. Limits of Resolution.- 3.10. Focusing System Design Considerations.- 4. Interaction of Ions with Solids.- 4.1. Introduction.- 4.2. Energy Losses.- 4.3. Channeling.- 4.4. Damage to the Sample.- 4.5. Sputtering.- 5. Practical Focused Ion Beam Optics and Systems.- 5.1. Introduction.- 5.2. Sources.- 5.3. Practical Focusing Optics.- 5.4. Lens Design.- 5.5. The Deflection System.- 5.6. E x B Mass Filter Design.- 5.7. Beam Alignment Techniques.- 5.8. Real Lens Defects.- 5.9. Magnetic Field Perturbations.- 5.10. Insulator Shielding.- 5.11. CoulombBeam Interactions.- 5.12. Wave Optics vs. Geometrical Optics.- 5.13. How to Evaluate the Performance.- 5.14. Detectors and Imaging.- 5.15. Ion Microscopy: Using Both Ions and Electrons to Image.- 5.16. Collecting Information: Forming Good Images.- 5.17. Imaging and Milling Vexations due to Charging.- 6. Applications of Focused Ion Beams.- 6.1. Introduction.- 6.2. Micro-Machining.- 6.3. Making A Cross-Section Cut.- 6.4. Tem Sample Preparation.- 6.5. Using Sample Damage to Advantage.- 6.6. Deposition of Materials.- 6.7. Enhanced Etch and Deposition.- 6.8. Scanning Ion Microscopy (SIM).- 6.9. Micro-Milling Copper.- 6.10. Access to Die Circuitry from the “Backside”.- 6.11. Secondary Ion Mass Spectrometry (Fib/Sims): The Exploitation of Destruction.- 6.12. FIB Implantation.- 6.13. FIB Lithography.- 6.14. Micro-Mechanical Devices (MEMS).- Appendix 1 Elements of the Theory of Field Desorption and Ionization.- Appendix 2 Table of Sputter Yields.- About the Authors.

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