Three-Dimensional Stacked Dies.
Cofired Ceramic Substrates.
Organic Laminated Substrates and Chip-on-Board.
High-Density Interconnects and Deposited Dielectrics.
Wire and Wirebonds.
Tape Automated Bonds.
Flip-Chip Bonds.
Device and Substrate Attachment.
Cases.
Leads.
Lead Seals.
Lid Seals.
Material and Product Evaluation Methods.
Rework Methods.
Bibliography.
Index.
DR. MICHAEL PECHT is a ten-ured faculty member with a
jointappointment in Systems Research and Mechanical Engineering,
and theDirector of the CALCE Electronic Packag-ing Research Center
at theUniversity of Maryland. He has an MS in electrical
engineering andan MS and PhD in engineering mechanics from the
University ofWisconsin. He is a Professional Engineer and an IEEE
Fellow. Heserves on the board of advisors for various companies and
was aWestinghouse Professor. He is the chief editor of the
IEEETransactions on Reliability, on the board of advisors for
IEEESpectrum, and a section editor for the Society of
AutomotiveEngineering.
DR. ABHIJIT DASGUPTA is a tenured faculty member with the
CALCEElectronic Packaging Research Center at the University
ofMaryland.
DR. JOHN W. EVANS is a program manager of the Electronic
PackagingProgram for NASA Headquarters in Washington, D.C.
JILLIAN Y. EVANS is an aerospace engineer at the NASA Goddard
SpaceFlight Center Facility in Greenbelt, Maryland
PHYSICAL ARCHITECTURE OF VLSI SYSTEMS Robert Hannemann, Allan
D.Kraus, and Michael Pecht
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