Warehouse Stock Clearance Sale

Grab a bargain today!


Chip on Board
By

Rating

Product Description
Product Details

Table of Contents

Preface; Acknowledgments; A brief introduction to wire bonding, tape automated bonding, and flip chip on board for multichip module applications; Making COB testing tractable: chip pretest and system diagnostics; Chip level interconnect; wire bonding for multichip modules; Chip level interconnect: wafer bumping and inner lead bonding; Chip level interconnect: solder bumped flip chip; Chip attachment; Wire bonding chip on board; Tape automated bonding chip on board and on MCM-D; Solder bumped flip chip attach on SLC board and multichip module; Micron bump bonding chip on board; chip on board encapsulation; Underfill encapsulation for flip chip applications; Index

Ask a Question About this Product More...
 
This title is unavailable for purchase as none of our regular suppliers have stock available. If you are the publisher, author or distributor for this item, please visit this link.

Back to top