Table of Contents

Part I: Introduction to Electronic Failure Analysis. Overview of Electronic Component Reliability. Overview of Electronic Systems Reliability. Product Liability. Part II: Electronic Failure Analysis Techniques. Photography and Optical Microscopy. X-Ray/Radiographic Component Inspection. Infrared Thermography. Acoustic Micro Imaging Failure Analysis of Electronic Devices. Metallography. Chemical Characterization. Electronic and Electrical Characterization. Scanning Electron Microscopy and X-Ray Analysis. Miscellaneous Techniques. Part III: Electronic Failure Analysis for Specific Technologies. Solder Joints. Failure Analysis of Printed Wiring Assemblies. Wires and Cables. Switches and Relays. Connection Technology. Failure Analysis of Components. Semiconductors. Power and High-Voltage Considerations.

About the Author

Perry Martin is group manager for reliability and process engineering in the Sacramento, California, division of National Technical Systems. His experience includes more than a decade of performing electronic failure analysis and environmental quality testing for the United States Air Force at McClellan Air Force Base in California. There he provided support and expertise in a number of areas, including the testing and repair of equipment such as avionics, crash and failure investigations for AF weapon systems, and contractor fraud inquiries. He has briefed both members of Congress and the Air Force Chief of Staff on his findings on faults in Air Force weapons systems.