Preface v
About the Authors vii
1 LEDs for Solid-State Lighting 1
1.1 Introduction 1
1.2 Evolution of Light Sources and Lighting Systems 1
1.3 Historical Development of LEDs 6
1.4 Implementation of White Light Illumination with an LED 8
1.5 LEDs for General Lighting 10
References 12
2 Packaging of LED Chips 15
2.1 Introduction 15
2.2 Overall Packaging Process and LED Package Types 16
2.3 Chip Mounting and Interconnection 20
2.4 Phosphor Coating and Dispensing Process 38
2.5 Encapsulation and Molding Process 48
2.6 Secondary Optics and Lens Design 50
References 54
3 Chip Scale and Wafer Level Packaging of LEDs 61
3.1 Introduction 61
3.2 Chip Scale Packaging 63
3.3 Enabling Technologies forWafer Level Packaging 66
3.4 Designs and Structures of LED Wafer Level Packaging 91
3.5 Processes of LED Wafer Level Packaging 96
References 106
4 Board Level Assemblies and LED Modules 111
4.1 Introduction 111
4.2 Board Level Assembly Processes 112
4.3 Chip-on-Board Assemblies 130
4.4 LED Modules and Considerations 137
References 141
5 Optical, Electrical, and Thermal Performance 145
5.1 Evaluation of Optical Performance 145
5.2 Power Supply and Efficiency 159
5.3 Consideration of LED Thermal Performance 163
References 172
6 Reliability Engineering for LED Packaging 175
6.1 Concept of Reliability and Test Methods 175
6.2 Failure Analysis and Life Assessment 181
6.3 Design for Reliability 185
References 187
7 Emerging Applications of LEDs 189
7.1 LEDs for Automotive Lighting 189
7.2 Micro- and Mini-LED Display 194
7.3 LED for Visible Light Communication 203
References 208
8 LEDs Beyond Visible Light 213
8.1 Applications of UV-LED 213
8.2 Applications of IR-LEDs 225
8.3 Future Outlook and Other Technology Trends 233
References 235
Index 243
Shi-Wei Ricky Lee, PhD, received his PhD degree in Aeronautical & Astronautical Engineering from Purdue University in 1992. Currently he is Chair Professor of Mechanical and Aerospace Engineering and Director of Foshan Research Institute for Smart Manufacturing at the Hong Kong University of Science and Technology (HKUST).
Jeffery C. C. Lo, PhD, received his Bachelor (1st Class Honour) and MPhil degrees in Mechanical Engineering from the Hong Kong University of Science and Technology (HKUST) in 2002 and 2004 respectively. He is currently the Program Manager at the Center for Advanced Microsystems Packaging at HKUST and Assistant Director of FRISM.
Mian Tao, PhD, received his MSc degree from the Hong Kong University of Science and Technology (HKUST) in Mechanical Engineering in 2010 and PhD degree in 2016. His research interests include thermal characterization and management of high power electronics and development of advanced microelectronic packages.
Huaiyu Ye, PhD, received his PhD degree from the Department of Microelectronics, Delft University of Technology in 2014. Currently he is Associate Professor of Southern University of Science and Technology (SUSTech).
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